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  photocoupler ps2702-1 high isolation voltage darlington transistor sop multi photocoupler series ? nepoc series ? description t he ps2702-1 is an optically coupled is olator containing a gaas light em itting diode and an npn silicon darlington- connected phototransistor. t h is is mounted in a plastic sop (small ou t-line package) for high density applications. t h is package has shield effect to cut off ambient light. features ? high current transfer ratio (ct r = 2 000% t yp.) ? high isolation voltage (bv = 3 750 vr.m.s.) ? small and thin (sop) package ? high-speed sw itching (t r , t f = 200 s t yp.) ? ordering number of taping product: ps2702-1-f 3 , f 4 ? safety standards ? ul approved: f ile no. e72422 ? bsi approved: f ile no. 8219/8220 ? csa approved: f ile no. ca 101391 ? din en60747-5-2 (vde0884 pa rt2) approved (option) applications ? hy brid ic ? t e lephone/f a x ? f a /oa equipment ? programmable logic controllers the mark ? show s major rev i sed points. document no. pn10241ej02v0ds (2nd edition) date published march 2006 cp(k) ? nec compound semiconductor devices, ltd. 1988, 2006
ps2702-1 package dimensions (in millimeters) ps2702-1 4.00.5 7.00.3 4.4 0.50.3 0.15 +0.10 ?0.05 2.0 0.10.1 2.10.2 2.54 0.4 +0.10 ?0.05 0.25 m top view 1. anode 2. cathode 3. emitter 4. collector 43 12 marking example 2702 m601 trade mark type number assembly lot no. 1 pin mark m6 0 1 week assembled year assembled (last 1 digit) ctr rank name *1 bar : pb-free remark "ps" and "-1" are omitted from original type number *1 data sheet pn10241ej02v0ds 2
ps2702-1 ordering information part number order number solder plating specification packing sty l e safety standard approval application part number *1 p s 2 7 0 2 - 1 p s 2 7 0 2 - 1 - a p b - f r e e magazine ca se 100 pcs standard products ps2702-1 ps2702-1-f3 PS2702-1-F3-A embossed tape 3 500 pcs/reel (ul, bsi, csa p s 2 7 0 2 - 1 - f 4 p s 2 7 0 2 - 1 - f 4 - a a p p r o v e d ) p s 2 7 0 2 - 1 - v p s 2 7 0 2 - 1 - v - a magazine case 100 pcs din en60747-5-2 p s 2 7 0 2 - 1 - v - f 3 p s 2 7 0 2 - 1 - v - f 3 - a embossed tape 3 500 pcs/reel (vde0884 part2) p s 2 7 0 2 - 1 - v - f 4 p s 2 7 0 2 - 1 - v - f 4 - a a p p r o v e d ( o p t i o n ) *1 f o r the application of the safety st andard, follow i ng part number should be used. data sheet pn10241ej02v0ds 3
ps2702-1 absolute maximum ratings (t a = 25 c, unless otherw ise specified) p a r a m e t e r s y m b o l r a t i n g s u n i t diode forw ard current (dc) i f 5 0 m a r e v e r s e v o l t a g e v r 6 . 0 v pow e r dissipation derating ? p d / c 0 . 8 mw/ c p o w e r d i s s i p a t i o n p d 8 0 m w peak forw ard current *1 i fp 1 a transistor collector to emitter voltage v ceo 4 0 v emitter to collector voltage v eco 6 v c o l l e c t o r c u r r e n t i c 2 0 0 m a pow e r dissipation derating ? p c / c 1 . 5 mw/ c p o w e r d i s s i p a t i o n p c 1 5 0 m w isolation voltage *2 b v 3 7 5 0 v r . m . s . operating ambient temperature t a ?55 to +100 c storage temperature t st g ?55 to +150 c *1 pw = 100 s, duty cy cle = 1% *2 ac voltage for 1 minute at t a = 25c, rh = 60% betw een input and output pins 1-2 shorted toget her, 3-4 shorted together. data sheet pn10241ej02v0ds 4
ps2702-1 electrical characteristics (t a = 25 c) p a r a m e t e r s y m b o l c o n d i t i o n s m i n . ty p . m a x . u n i t d i o d e f o r w ard v o l t a g e v f i f = 5 ma 1.1 1.4 v r e v e r s e c u r r e n t i r v r = 5 v 5 a t e r m i n a l c a p a c i t a n c e c t v = 0 v, f = 1 mhz 30 pf transistor collector to emitter dark current i ceo i f = 0 ma, v ce = 40 v 400 na coupled current transfer ratio (i c /i f ) *1 c t r i f = 1 ma, v ce = 2 v 200 2 000 % collector saturation voltage v ce (s at) i f = 1 ma, i c = 2 ma 1.0 v i s o l a t i o n r e s i s t a n c e r i-o v i-o = 1 kv dc 1 0 11 ? i s o l a t i o n c a p a c i t a n c e c i-o v = 0 v, f = 1 mhz 0.4 pf r i s e time *2 t r v cc = 5 v, i c = 2 ma, r l = 100 ? 2 0 0 s f a l l ti me *2 t f 2 0 0 *1 ct r rank k : 2 000 to (%) l : 700 to 3 400 (%) m: 200 to 1 000 (%) *2 t e st circuit for sw itching time pw = 1 ms, duty cycle = 1/10 pulse input v cc v out r l = 100 ? 50 ? i f input monitor data sheet pn10241ej02v0ds 5
ps2702-1 typical characteristics (t a = 25c, unless otherw ise specified) 100 50 25 0 75 25 50 75 100 ambient temperature t a (?c) diode power dissipation p d (mw) diode power dissipation vs. ambient temperature 200 150 100 50 0 25 50 75 100 ambient temperature t a (?c) transistor power dissipation p c (mw) transistor power dissipation vs. ambient temperature 1.5 mw/?c 50 000 1 1 000 5 000 100 10 10 000 500 50 5 ?60 0 4 0 8 0 ?40 ?20 20 60 100 ambient temperature t a (?c) collector to emitter dark current vs. ambient temperature collector to emitter dark current i ceo (na) v ce = 40 v 24 v 10 v 5 v 2 v 100 0.1 1 0.01 10 0.6 1.0 1.4 1.6 0.8 1.2 forward voltage v f (v) forward current i f (ma) forward current vs. forward voltage +25 ?c 0 ?c ?25 ?c ?55 ?c t a = +100 ?c +75 ?c +50 ?c 180 80 0 140 120 20 40 60 100 160 61 24 8 collector to emitter voltage v ce (v) collector current i c (ma) collector current vs. collector to emitter voltage 0 i f = 5 ma 0.5 ma 1 ma 2 ma 300 10 0.1 30 0.3 100 3 1 0.6 1.2 1.6 0.4 0.8 1.4 1.0 collector saturation voltage v ce (sat) (v) collector current i c (ma) collector current vs. collector saturation voltage i f = 10 ma 1 ma 0.5 ma 5 ma 0.2 ma 0.1 ma remark t he graphs indicate nominal characteristics. data sheet pn10241ej02v0ds 6
ps2702-1 1.2 0.6 0.0 0.8 1.0 0.4 0.2 0 25 50 100 10 0 0 1 000 2 000 3 000 4 000 5 000 6 000 7 000 8 000 9 000 10 000 500 1 000 1 500 2 000 2 500 3 000 50 100 300 10 15 0.5 ?50 ?25 75 ambient temperature t a (?c) normalized current transfer ratio vs. ambient temperature normalized current transfer ratio ctr normalized to 1.0 at t a = 25 ?c, i f = 1 ma, v ce = 2 v forward current i f ( a) current transfer ratio ctr (%) current transfer ratio vs. forward current forward current i f (ma) current transfer ratio ctr (%) current transfer ratio vs. forward current 1 000 5 1 500 100 50 10 50 500 5 k 100 1 k load resistance r l ( ? ) switching time vs. load resistance switching time t ( s) v cc = 5 v, i c = 2 ma, ctr = 2 200 % t f t r t d t s 5 000 1 500 1 000 50 5 100 10 50 500 5 k 1 k 10 k 50 k 100 load resistance r l ( ? ) switching time vs. load resistance switching time t ( s) i f = 1 ma, v cc = 5 v, ctr = 2 200 % t f t s t r t d ?10 ?20 0 ?5 ?15 5 100 0.5 1 0.1 5 1 0 50 frequency f (khz) normalized gain g v frequency response i f = 1 ma, v ce = 2 v r l = 100 ? v ce = 2 v v ce = 2 v remark t he graphs indicate nominal characteristics. data sheet pn10241ej02v0ds 7
ps2702-1 1.2 1.0 0.0 0.4 0.2 0.8 0.6 10 2 10 3 11 0 4 10 5 10 6 time (hr) long term ctr degradation ctr degradation (relative value) i f = 1 ma, t a = 25 ?c i f = 1 ma, t a = 60 ?c remark t he graph indicates nominal characteristics. data sheet pn10241ej02v0ds 8
ps2702-1 taping specifications (in millimeters) tape direction outline and dimensions (reel) packing: 3 500 pcs/reel 2.00.5 r 1.0 13.00.2 21.00.8 3302.0 1001.0 2.0 0.5 11.9 to 15.4 outer edge of flange 17.51.0 13.51.0 13.00.2 ps2702-1-f3 ps2702-1-f4 1.550.1 2.00.05 4.00.1 1.750.1 4.60.1 2.9 max. 0.3 8.00.1 outline and dimensions (tape) 2.40.1 1.5 +0.1 ?0 7.40.1 5.50.05 12.00.2 data sheet pn10241ej02v0ds 9
ps2702-1 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering ? peak reflow temperature 260 c or below (package surface temperature) ? t i me of peak reflow temperature 10 seconds or less ? t i me of temperature higher than 220 c 60 seconds or less ? t i me to preheat temperature from 120 to 180 c 120 30 s ? number of reflow s t h ree ? f l ux rosin flux containing small amount of chlorine (t he flux w i th a maximum chlorine content of 0.2 w t % is recommended.) 12030 s (preheating) 220?c 180?c package surface temperature t (?c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260?c max. 120?c (2) wav e soldering ? t e mperature 260 c or below (molten solder temperature) ? t i me 10 seconds or less ? preheating conditions 120 c or below (package surface temperature) ? number of times one (allow ed to be dipped in solder including plastic mold portion.) ? f l ux rosin flux containing small amount of chlorine (t he flux w i th a maximum chlorine content of 0.2 w t % is recommended.) (3 ) solde r ing by s o lde r ing iron ? peak temperature (l ead part temperature) 350 c or below ? t i me (each pins) 3 seconds or less ? f l ux rosin flux containing small amount of chlorine (t he flux w i th a maximum chlorine content of 0.2 w t % is recommended.) (a) soldering of leads should be made at the poi nt 1.5 to 2.0 mm from the root of the lead. (b) please be sure that the temperatur e of the package w oul d not be heated over 100 c. data sheet pn10241ej02v0ds 10
ps2702-1 (4 ) ca utions ? f l uxes avoid removing the residual flux w i th freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aw are that w hen voltage is applied suddenly bet w een the photocoupler?s i nput and output or betw een collector-emitters at startup, the output transistor may enter the on state, even if the voltage is w i thin the absolute max i mum ratings. 3. measurement conditions of current transfer ratios ( c tr) , w h ich differ according to photocoupler check the setting values before use, since the forw ard current conditions at ct r measurement differ according to product. w hen using products other than at the specified forw ard current, the char acteristics curves may differ from the standard curves due to ct r value variati ons or the like. t heref ore, check the characte ristics under the actual operating conditions and thoroughly take variations or the like into cons ideration before use. usage cautions 1. protect against static electricity w hen handling. 2. avoid storage at a high te mperature and high humidity . data sheet pn10241ej02v0ds 11
ps2702-1 specification of vde marks license document (vde0884) p a r a m e t e r s y m b o l s p e c k u n i t application classification (din vde 0109) for rated line voltages 300 vr.m.s. for rated line voltages 600 vr.m.s. iv iii climatic test class (din iec 68 teil 1/09.80) 55/100/21 dielectric strength maximum operating isolation voltage test voltage (partial discharge test, procedure a for ty pe test and random test) u pr = 1.2 u io rm , p d < 5 pc u io rm u pr 710 850 v peak v peak test voltage (partial discharge test, procedure b for all devices test) u pr = 1.6 u io rm , p d < 5 pc u pr 1 1 4 0 v peak highest permissible overvoltage u tr 6 0 0 0 v peak degree of pollution (din vde 0109) 2 clearance distance > 5 mm creepage distance > 5 mm comparative tracking index (din iec 112/vde 0303 part 1) cti 175 material group (din vde 0109) iii a storage temperature range t st g ? 55 to +150 c operating temperature range t a ?55 to +100 c isolation resistance, minimum value v io = 500 v dc at t a = 25 c v io = 500 v dc at t a max. at least 100 c ris min. ris min. 10 12 10 11 ? ? safety maximum ratings (maximum permi ssible in case of fault, see thermal derating curve) package temperature current (input current i f , psi = 0) pow e r (output or total pow er dissipation) isolation resistance v io = 500 v dc at t a = 175 c (ts i ) ts i isi psi ris min. 150 200 300 10 9 c ma mw ? data sheet pn10241ej02v0ds 12
ps2702-1 when the product(s) listed in this document is subject to an y applicab le impor t or e xpor t control la ws and regulation of the au thor ity ha ving competent jur isdiction, such product(s) shall not be impor ted or e xpor ted without obtaining the impor t or e xpor t license . m8e 00. 4 - 0110 the information in this document is current as of march, 2006. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use o f such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility o f customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that t h e possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications o f a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. " standard" : computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots " special" : transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) " specific" : aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. i f customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec' s willingness to support a given application. (note) ( 1 ) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ? data sheet pn10241ej02v0ds 13
ps2702-1 caution gaas products this product uses gallium arsenide (g aas). gaas vapor and pow der are hazardous to human health if inhaled or ingested, so please observe the follow i ng points. ? follow related law s and ordinances w hen disposi ng of the product. if there are no applicable law s and/or ordinances, dispose of the product as recommended below . 1. commission a disposal company able to (w it h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial w a ste materials. 2. exclude the product from general industria l w a ste and household garbage, and ensure that the product is controlled (as industrial w a ste subjec t to special control) up until final disposal. ? do not burn, destroy , cut, crush, or chemically dissolve the product. ? do not lick the product or in any w a y allow it to enter the mouth. nec compound semiconductor de vices hong k ong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales , technical and gener al) hong k ong head office t aipei br anch office k orea br anch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 f ax: +852-3107-7309 f ax: +886-2-2545-3859 f ax: +82-2-558-5209 nec electr onics (eur ope) gmbh http://www .ee .nec.de/ tel: +49-211-6503-0 f ax: +49-211-6503-1327 calif ornia eastern laboratories, inc. http://www .cel.com/ tel: +1-408-988-3500 f ax: +1-408-988-0279 0504 nec compound semiconductor de vices, ltd. http://www .ncsd.necel.com/ e-mail: salesinf o@ml.ncsd.necel.com (sales and gener al) techinf o@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1573 f ax: +81-44-435-1579 for fur ther inf ormation, please contact
4590 p a t r ick hen r y drive san t a c l ara, ca 9505 4- 181 7 teleph o n e : ( 408) 919- 25 00 facsim ile: ( 408 ) 988- 027 9 subject: compliance with eu dire ctives cel certifies, to its kno w ledge, that semicondu ctor and laser products detailed below are compliant with the requirements of european union (eu) directive 2002/95/ec restriction on use of hazardous substances in electrical and electron ic equipment (rohs) an d the requir e ments of eu directive 2003/11/ec restriction o n penta and octa bde. cel pb-free products ha ve the same base part n u mber with a suffix added. the suffix ?a indicates that the device is pb-fre e. the ?az suffix is use d to designa te devices containing pb which are exempted from the requirement of ro hs directive (*). in all cases the de vices have pb-free terminals. all devices with these suffixes meet the require ments of the rohs directive. this statu s is based on cel?s understanding of t he eu directives and kn owledge of the materials that go into its pr oducts as of the date of disclo s ure o f this inform ation. re st rict e d s u bst a n c e per rohs con c e n tratio n limit per rohs (value s are n o t yet fixed) con c e n tratio n contai ned in cel devices - a - a z lead (p b) < 100 0 ppm not dete cted (*) mercury < 100 0 ppm not dete cted cadmi u m < 100 ppm not dete cted hexavale nt chromi um < 100 0 ppm not dete cted pbb < 1000 ppm not detec t ed pbde < 1000 ppm not detec t ed if you should have any additional q uestions reg a rding our d e vices and compliance t o environme n tal standards, p l ease do not hesitate to contact your local representative. important inf o rm ation and disclaimer: infor m ation provided b y cel on its w ebsite or in other communi cations concertin g the subs tance content of its pro ducts represents know ledge and b e lief as of t he date that it is provided. cel bases its know ledge a n d belief on informa t ion provided b y t h ird parties and make s no representa t ion or w a rran t y a s to the accurac y of such information. efforts are u nder w a y to b e tte r integrate informa t ion from third pa rties. cel has ta ken and cont inue s to take reasona ble steps to provide repr esentative and ac cur a te information but ma y not h a ve conducted destructive testing or chemical analy s is on incoming ma terials and chemicals. cel and ce l suppliers consid er certain inform ation to be pro p ri etar y , and thus c as numbers and other limited information ma y not be availab le for release. in no event shall cel?s liability ari s ing out of such information e x cee d the total purch ase price of the cel part ( s) at issue s old by cel to customer on an annual basis. see cel te rms and conditions f o r additional cl arification of w a rran t ies and liability .


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